COMPLETE PEACE OF MIND.
Glotronic’s comprehensive parts testing ensures authenticity, conformance and functionality. We actively report all instances of suspect-counterfeits in the supply chain. Our standards match ISO-9001-2015 and we’re committed to providing our customers with peace of mind with their purchasing experience. Formal test reporting ensures that your components work as you expect, and our hassle-free returns policy ensures that your purchases are protected.
Our component authenticity inspections and tests include:
- Document and Packaging Inspection
- External Visual Inspection
- Material Analysis/Device Composition
- Inspection RoHS Compliance/ MIL Lead Compliance
- Physical Dimension Inspection
- X-Ray Screening and Inspection
- Marking Permanency Inspection
- Blacktopping Inspection
- IC Decapsulation/De-lidding
- DIE Verification
- Solvent Testing (Resistance and Heating)
- Solderability Testing
- Failure Analysis
External Visual Testing Services
While product variations do not necessarily mean counterfeit components, Glotronic is always vigilant. Because we truly understand manufacturer supply chains, engineering controls and the manufacturing process, we know when variations are evidence of counterfeiting or something unique to the manufacturer.
XRF Screening
(Restricted materials testing)
The EU RoHS Directive (2011/65/EU) restricts the maximum allowable levels of lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyl (PBB) and polybrominated diphenyl in electrical equipment and electronic products. XRF is a non-destructive x-ray test that helps detect the presence, or absence, of these materials.
Marking & Permanency Testing
Counterfeiters often have unauthorized access to scrap or excess components. Marking and permanency tests help determine if these components have been remarked or resurfaced. Marking and Permanency tests are based on the following industry standards: AS5553, MIL-STD-202 and JESD22- B107C
JTAG Testing
With our JTAG / Boundary Scanning we are able to utilize thousands of test points using only four test access points. They enable us to test connections between the pins of ICs.
Radiography (X-ray) Testing
Glotronic uses real-time X-ray technology to examine electronic components. Xray inspection is a non-destructive test that verifies the bond
wire connections and offers a chance to perform die size comparisons.
Solderability Testing
Solderability testing allows us to determine whether a component can be successfully soldered onto another surface in the next level assembly using SnPb or Pb-free solder. We follow the joint standard J-STD-002 accept-reject criteria for all thru-hole, surface mount, and BGA devices.
Decapsulation/Delidding
“Decap” is a “destructive test” that helps verify the
manufacturer die to ensure that it is indeed the correct one. The component’s insulation package is removed to reveal the die and is viewed under high-power magnification.
Pre-shipment Inspection
Glotronic’s pre-shipment inspection process is a systematic inspection of randomly selected components from your order. It is the final phase before your order ships and allows us the opportunity to take corrective action before your order is packed.